A checklist for advanced semiconductor production processes.
Control surface roughness and contamination levels.
Control overlay accuracy and critical dimensions.
Control film thickness uniformity and etch selectivity.
Ensure measurement accuracy and repeatability.
Minimize false positive and false negative rates.
Control overlay errors to meet design specifications.
Minimize die damage and kerf loss.
Ensure reliable electrical and mechanical connections.
Ensure hermeticity and reliability of the package.
Identify and address process variations.
Analyze yield losses and implement corrective actions.
Use data analysis and process modeling techniques.