
Cressem
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Cressem is creative assembly solution provider for the Electronics manufacturing industry.
Cressem provides Ultrasonic ACF bonding solution of the FOF(Flex On Flex), FOB and FOG assembly.
It is the most advanced assembly technology for Display, TSP, Smart card, Wearable & Flexible device, mobile device and smart glass manufacturing business.
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underfill material, oca, ocr, packing material, ultrasonic acf bonder
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