Finetech

About

Finetech is a leading global supplier of micro assembly and professional SMD rework equipment for customers involved in the development and manufacturing of opto- and microelectronics. Finetech's die bonder systems, with up to 0.3 micron placement accuracy, support a wide range of advanced bonding technologies to implement the most precise and complex applications.

Finetech follows the "Prototype-to-Production" approach to support customers at the development stage and help them transition their processes into production. This makes Finetech equipment the perfect fit for flexible and cost-efficient product development and manufacturing.

The company serves a broad range of industries, including Datacom & Telecom, Industrial Semiconductor, Consumer Electronics, Medical, Aerospace & Avionics, Automotive, Defense & Security, Energy, as well as universities and research facilities. With subsidiaries on three continents and a global network of representatives, Finetech ensures quick response times, fast on-site service and personal consultation

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application & process support, precision engineering, production equipment, flip chip bonder, photonics, manual die bonder, automated die bonder, eutectic bonding, epoxy bonding, r, d equipment, high power laser bonding, si photonics, chip on submount assembly, smd rework, sensor assembly, detector bonding, optical transceiver assembly, submicron bonding

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