Siltectra GmbH
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SILTECTRA is specialized in wafer treatment technologies. Based on research made at Harvard the company developed the patented "Cold Split" process, an innovative new technology applicable for kerf-free wafering and thinning of wafers or other thin substrates made of brittle materials.
The PV industry uses "Cold Split" for cost savings in cell manufacturing while silicon wafers can be manufactured without losing precious material during wire-sawing. The compound semiconductors industry (e.g. LED, power electronics) uses this eco-friendly technology for reclaiming multiple thin wafers from one thicker wafer or for wafer thinning. SILTECTRA's technology is proven for commonly used semiconductor materials like silicon, gallium arsenide, and germanium. R&D activities were recently extended towards very hard materials like silicon carbide, gallium nitride, sapphire, and ceramics - all candidates for future semiconductor devices. While bringing the costs of such substrates down, SILTECTRA has potential being an enabler for fast growing future compound semiconductors and MEMS markets.
Keywords
ingot wafer spalling, grinding replacement, wafering, thinning, backside grinding, laser, slicing
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