NHanced Semiconductors, Inc.

About

NHanced Semiconductors is pioneering the future of advanced chip packaging. Our deeply experienced team applies decades of semiconductor expertise to solve today's most pressing challenges.

Led by industry veteran Bob Patti, we are spearheading next-generation architectures. We wield cutting-edge processes like 3D stacking, 2.5D interposers, high density interconnect, and chiplets to deliver brilliant solutions. We call it Foundry 2.0.

Whether you require interposers, 2.5D assembly, TSV insertion, 3D stacking, or mixed-material integration, we've got you covered. Our fabs provide in-house process R&D, prototype fabrication, and small- to mid-volume manufacturing.

With more than 70 advanced materials to work with and strong industry partnerships, we make the future of chip packaging a reality.

Contact us to bring your bold chip vision to life.

Keywords

advanced packing, beol processing, 3d & 25d integration, interposer, chiplet designs, prototyping, waferlevel & dielevel stacking & thinning, 25, 3d design support, custom silicon interposers, r, d services, concept to prototype, small to midvolume manufacturing, process development, iiiv & other exotic materials, photonics, micro transfer printing, high density interconnect

Amenities

No amenities listed yet

Upcoming Events

No upcoming events scheduled

Frequently Asked Questions

No reviews yet. Be the first to review!

Social Links

Photo Gallery

No photos available

Contact Information

Business Info

Location

Business Hours

Business hours not available